MEMS Foundry

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MEMS Foundry

ULCOAT have produced prototype and mass production of glass MEMS to using of the processing technology of semiconductor mask blanks, large-sized mask blanks.

Glass MEMS Foundry

ULCOAT have produced prototype and mass production of glass MEMS to using of the processing technology of semiconductor mask blanks, large-sized mask blanks.

Merit of ULCOAT's Glass MEMS Foundry

Micro devices such as μ−TAS、micro chemical systems, and DNA chips are formed on glass substrate with semiconductor technology.

Deposition of metal films, patterning
Fabrication of micro channels
Direct bonding
Glass substrate size : max 370mmX470mm
MEMS

MEMS(Micro Electro Mechanical Systems) also called micro machine or MST(Micro System Technology) are very useful devices, and the structures on the devices can be smaller than microns. Also they can be produced on silicon substrates and/or glass substrates using semiconductor technology.

Process

Process

We offer all sorts of manufacturing process to carry out MEMS devices with glass substrate.

Design & Simulation

Pattern design
Process design
  • Design of manufacturing process of fluid MEMS on glass substrate

Photolithography

Phtotoresist Coating
  • Positive Photoresist
  • Negative Photoresist
  • Photoresist for MEMS
Double-sided Aligner

Double-sided Aligner

Double-sided Aligner

  • Mask…5 inches, 6 inches, and 9 inches square
  • Substrate size…maximum 8 inchesΦ or 6 inches square
Electron-Beam Exposure System

Electron-Beam Exposure System

Electron-Beam Exposure System

  • Direct writing
  • Photomask production of simple pattern
  • Substrate size…4 to 8 inchesΦ or 4 to 6 inches square
Phoresist Delopment

Phoresist Delopment

Phoresist Delopment

  • Paddle development
  • Spin development
Photoresist Removal
  • Hot sulfuric acid
  • Organic solvent
  • Resist stripper
CD Measurement

CD Measurement

CD Measurement

  • Optical measuring

Deposition

Sputtering

Sputtering

Sputtering

  • Our main materias : Cr、Cu、Ti、Ta、Al、Al-Si、Au、Ag、W、Ni、Si、SiO2、MoSi etc. Please let us know if you have any other requests. Click here for inquiry.
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Thermal Chemical Vapor Deposition
  • GNF(Graphite Nano Fiber)

Wet Etching

Processing Object:
  • Various type of glass (Quartz, non-alkaline glass, borosilicate glass) substrates
  • Wet etching of various types of material thin film such as Au, Cr, and Al.

Wet etching bench

Wet etching bench

Borosilicate glass wet etch

Borosilicate glass wet etch

Cleaning

Methods :
  • RCA Clean
  • DI water Clean

Drying

Methods :
  • IPA vapor Drying
  • Spin Dry
  • N2 blow Drying

Blasting

Blasting

Blasting

Bonding

Oven for Glass direct Bonding

Oven for Glass direct Bonding

Direct bondings are possible to quartz glass, non-alkaline glass and borosilicate glass.

  • Non-alkali Glass
  • Borosilicate Glass
  • Quartz
  • Substrate size : maximum 470X250mm

Analysis

Shape observation
  • SEM + EDX Scanning Electron Microscopy + Energy Dispersive X-ray spectroscopy

    Scanning Electron Microscopy

    Scanning Electron Microscopy

  • AFM Atomic Force Microscopy

    Atomic Force Microscopy

    Atomic Force Microscopy

  • Optical Microscopy
  • Laser Microscopy
  • Surface profiling
Chemical Analysis
  • AES Auger Electron Spectroscopy

    Auger Electron Spectroscopy

    Auger Electron Spectroscopy

  • Micro Laser RAMAN Spectroscopy

    Micro-Raman Spectroscopy

    Micro-Raman Spectroscopy

Characterization

Electrical Characteristics
  • Sheet Resistance
Optical Characteristics
  • Reflectance/Transmittance
  • Other
Substrate size : maximum 470X250mm