Functional Device Production Department has changed its name from the FPD division. On the base of technology from the FPD division, the department manufactures and sells MEMS (Micro Electro Mechanical Systems) related products. Glass mold plates are the focus of attention. There are more than millions of small cavities on the surface of the glass mold plates and the mold plates are used for soldering electrodes on ULSI. This is should be a new and innovative technology. Moreover, we can form super fine channels and holes, and it's applied to sensors for DNA measurement and bio-chips. While we are still producing thin film products related to FPD(flat panel display), we also expand our business to glass MEMS products using micro patterning technology. In FPD thin film products, we produce BM for color filters（Black Matrix/divides the three primary colors and creates a beautiful screen）used in TFT-LCD. Especially, ULCOAT has an excellent reputation in the color filters market asa Cr-BM manufacturer, also we have already mass produced a Cr free film, Ni-based alloy for keeping our precious environment.

Features

ULCOAT forms a great amount of super precise pit cavities（diameter: 30 to 200μm, depth: 10 to 60μm） on a glass surface with the photolithography process (cleaning, deposition, exposure, chemical etching).

Application

C4NP, especially, lead free solder bump process.

Glass Mold for C4NP	Micro Cavities (Fabricated by Wet Etching)

Features

ULCOAT's bio MEMS form super precise electrodes, interconnections,channelsand/or holes on glass substrates with photolithography process( a micro-processing technology by MEMS technology).

Application

DNA chip, Lab on a chip and so on.

Bio Chip (Thin film electrodes are deposited by sputtering)	DNA-CHIP (Fabricated by Wet Etching+Micro Drill)

Features

ULCOAT's glass MEMS forms super precise electrodesarray, interconnections, channelsand/or holes on glass substrates with photolithography process (a micro-processing technology by MEMS technology). As for glass MEMS (Micro Electro Mechanical Systems) productions, We manufacture functional parts utilized in diverse leading fields, making use of the condensed matter of glass, and the deposition technology in an order of angstrom (1/10,000,000 mm) and the micro processing technology in an order of micron (1/1000mm) and dry etching technology. In a part of a glass MEMS, there are bio-related DNA-CHIPs, chemical analysis CHIPs called μ-TAS, and molds for a solder bumping process (C4NP) for high-end semiconductor devices.

Application

Glass MOLD, BIO chip, etc.

Glass MEMS	Micro Fluidic Device (Fabricated by Micro Blast)

Features

Wedeposit low reflectance thin filmswithout thickness variation on glass substratesusing sputtering. We also supply thin film blanks for color filters which are Cr free as environmentally friendly products.

Application

It's used for super precise color filters.

･ Maximum plate size : 730 x 920

･ Optical Properties : We will meet the needs of customers regarding optical properties and so on. [ Click here for inquiry.]

Features

Micro-Total Analysis System (μ−TAS) by chips manufactured with MEMS technology

Application

Chemical analysis and reaction processes

Features

ULCOAT deposit various materials on glass substrates with sputtering.

Materials

Cr, Ni, Cu, AL, Ti, Ta, Si, Mo, Ag, Au, Pt

Please let us know if you have any other requests. [ Click here for inquiry.]

Features

ULCOAT pattern thin films of various materials with photolithography process.

Features

IBM has developed the C4NP (Controlled Collapse Chip Connection New Process) and the technology has been practicable under the technical cooperation between IBM and SUSS MicroTec. The process is utilized for forming leading free bumps of high-end semiconductor devices with ULCOAT's highly accurate, low defective molds.

Application

Semiconductor device (CPU, 3D CHIP)