Semiconductor integrated circuits, such as LSI and Ultra LSI, are the heart of computers and electronic products, which have become the infrastructure of today's economy and society. Mother plates are called hard mask blanks, used in the photolithography process of the production of semiconductor integrated circuits and form ultra fine patterns with 90 nanometer width and below. ULCOAT developed low reflective mask blanks consist of metal chrome and chrome oxide ahead of the times.

TFT-LCD and flat panel displays have become larger in size and emerged as mainstream, replacing a cathode ray tube. Asian countries including Japan are leaders in the display industry. ULCOAT provides numbers of large mask blanks which are essential lithography materials in the production of FPD and has gotten a high reputation in the FPD market. Larger size plates need automation production lines to achieve higher quality and more volume. We have years of experience with automation technology for such plates.

Functional Device Production Department has changed its name from the FPD division in order to spread the coverage of our technology area. On the basis of technology from the FPD division, the department manufactures and sells MEMS (Micro Electro Mechanical Systems) related products. Glass mold plates for C4NP are the focus of attention. There are more than millions of small cavities on the surface of the glass mold plates and the mold plates are used for soldering electrodes on ULSI. This is should be a new and innovative technology. Moreover, we can form  super fine channels and holes, and it's applied to sensors for DNA measurement and bio-chips. We have mass produced both Cr films and Cr free films for the plates for BM (Black Matrix).

One of the biggest supplier of mask blanks (mother plates) for semiconductors, we have a great amount of experience with treating of glass substrates and metal deposition technology. With these technologies, we offer MEMS Foundry services such as manufacturing various devices on glass substrates, suitable for μ-TAS, using wet etching, dry etching, blasting, bonding and so on.