With the Si MEMS technology, ULCOAT offer to fabricate sensor devices on a Si chip to measure physical quantity such as acceleration or pressure that couldn't be achieved with only CMOS circuits used in an ordinary LSI.

Prototype Manufacturing and Mass Production of Si Devices

ULCOAT's Si MEMS Foundry offers prototype manufacturing and mass production of various types of Si MEMS such as stencil mask, accelerometer and pressure sensor, using the leading technology of MEMS such as simulation technology of anisotropic single-crystal silicon substrate wet etching, sticking free dry technology and so on.

Si substrate: up to 6inches ø

We offer prototype manufacturing and mass production of glass MEMS devices using our technology of glass substrate　based on our technology to manufacture Cr mask blanks for semiconductors, large size mask blanks for flat panel displays, and black matrix for color filters.

Micro devices such as μ-TAS, micro chemical systems, and DNA chips are formed on a glass substrate with semiconductor technology.

･ Deposition of metal films, patterning

･ Fabrication of micro　channels

･ Direct bonding

･ Glass substrate size

max 370mm x 470mm

MEMS(Micro Electro Mechanical Systems) also called micro machine or MST(Micro System Technology) is very useful devices, and the structures on the devices can be smaller than microns. Also they can be produced on silicon substrates and/or glass substrates using semiconductor technology.

We offer all sorts of manufacturing processes to carry out MEMS devices with Si and glass substrate.

Pattern design

Process design

･ Design and development of manufacturing process of Si MEMS

･ Design of manufacturing process of fluid MEMS on glass substrates

Anisotropic silicon wet etching Simulation

･ Etchant：TMAH, KOH

Photoresist Coating

･ Positive Photoresist

･ Negative Photoresist

･ Thick Photoresist for MEMS

Double-sided Exposure

Double-sided Aligner

･ Mask
  5 inches, 6 inches, and 9 inches square

･ Plate
  maximum 8 inches ø or 6 inches square

EB Exposure

Electron-Beam Exposure System

･ Direct writing

･ Photomask production
  of simple pattern

･ Substrate size … 4 to 8 inches ø
  or 4-6 inches

･ Direct writing onto Si substrates

･ Mask fabrication

Development

Phoresist Development

･ Paddle development

･ Spin development

Photoresist Removal

･ Plasma Ashing

･ Hot sulfuric acid

･ Organic solvent

Line width measurement

CD Measurement

･ Optical measuring

Merit of Sputtering Deposition

	Sputtering

･ Low density

･ Stress control

･ Au, Pt, Cr, W, Ti, Ni, Al, Al-Si, Si, SiO2, MoSi, ITO and other materials

Thermal Chemical Vapor Deposition

･ GNF (Graphite Nano Fiber)

Materials :

Various types of glass （crystal, quartz, non-alkaline glass, borosilicate glass ）substrates

Maximum　6inches ø, 4inches （the etching depth over 1μm）

Maximum　5〜6inches （the etching depth under 1μm）

Etching sample of Borosilicate Glass

･ Silicon oxide film (thermal oxide, PSG and BPSG)

･ Metal thin films (Cr, Al, MoSi, Ag and other)

･ Si substrate

･ Silicon deep trench etching: maximum 6 inches ø

Materials:

･ Various types of glass （quartz, alkali-free glass, borosilicate glass ）substrate

･ Silicon oxide film (thermal oxide films, PSG and BPSG)

･ Anisotropic etching of single-crystal silicon substrate（etching solution：TMAH, KOH）

･ Wet etching of various types of metal thin films such as Au, Pt, Cr, and Al.

Wet Etching	Wet Etching sample of Borosilicate Glass

Methods:

･ RCA treatment

･ Ultra pure Water Rinsing

Methods:

･ IPA vapor Dry

･ Spin Dry

･ N2 blow Dry

Direct bonding on various types of glass such as quartz, alkali-free glass, borosilicate glass is possible

･ Alkali-free Glass

･ Borosilicate Glass

･ Quartz

･ Substrate size: maximum 470mm x 250mm

Morphology Determination

･ SEM	･ AFM
Scanning Electron Microscopy	Atomic Force Microscopy

･ Optical Microscopy

･ Laser Microscopy

･ Surface profiling

Chemical Analysis

･ AES	･ Microscopic Raman   Spectrometry Analysis
Auger Electron Spectroscopy	Micro Laser RAMAN Spectroscopy

Electrical Characteristics

･ Sheet Resistance

Optical Characteristics

･ Reflectance / Transmittance

･ Other

･ Plate size: maximum 470mm x 250mm