In ultra LSI became indispensable to use in all fields, by the state-of-the-art photolithography using ULCOAT’s Mask Blanks that have been pattarning to Mask and exposeing as fine circuits on silicon wafers. Establishment of the development and mass production technology of the Mask Blanks that correspond to the progress of semiconductor miniaturization will be a more important theme in the future.
ULCOAT are using of a variety of advanced technology, such as an ultra-high vacuum technology, vacuum plasma technology, ultra-clean surface treatment technology. Also including semicondutor Mask Blanks for photolithography, a thin film pattern products for a variety of devices, we have contributed significantly to the electronics industry by the global supply. In addition, products such as bio-chips are expected they are also in the field in recent years of the life sciences.
Semiconductor integrated circuits, such as LSI, and Ultra LSI, are the heart of computers and electronic products, that have become infrastructure of today's economy and society.
The original plates are called Mask Blanks. From these Mask Blanks, Masks are produced that are used in photolithography process of the production of semiconductor integrated circuits and form ultra fine patterns with 40 nanometer width and below. As a pioneer, ULCOAT developed low reflective mask blanks in the structure of metal chrome and chrome oxide.
ULCOAT provide a lot of large Mask Blanks which are essential lithography materials in production of FPD and has gotten a high reputation in the FPD market.
Also for next generation blanks or ULCOAT's attenuated phase shift mask blanks, halftone blanks are made by us as a pioneer.
We have much experiences with precise grade, larger size and automation technology for such plates.
ULCOAT produce and sell MEMS (Micro Electro Mechanical Systems) products based on technology developed in the FPD.
As a product of example, glass mold plates. These are created by an ultra-precise "pit cavities" in the glass surface, intended to be used during the solder bonding the electrode of the silicon chip at the time of LSI manufacturing. In addition to the "pit cavities" in the glass processing, also we can make such as ultra-fine "channels" "holes". These are applied such as DNA sensors and bio-chips.
ULCOAT have accumulation of the glass substrate processing and metal deposition technologies, as a leading supplier of semiconductor mask blanks by defect-free.
The basis of these technologies, optimal various glass substrates in the manufacture of such μ-TAS, of the silicon substrate wet etching, blasting, and bonding, ULCOAT offer MEMS foundry services.