ULCOAT are producing Glass MEMS Products which are applied to various coating technologies and photolithography, patterning processes. These Glass MEMS Products will have been expected in the future. The DNA-Chips are used the fine processing of glass to be used in bio-analysis of life science applications in which we have been attracting attention in recent years. These are preparing to the small size for Lab level, also to large size for high-performance genome analysis.
And miniaturization and high performance of a variety of mobile devices have supported the evolution of the IT society. We are also producing and selling such as glass MOLD to be used in the solder bump process of lead-free to high-end LSI and 3D chip.
In addition, we are corresponding from prototype to mass production for a thin film coating which materials are not only Chrome, Non-Chrome but Au・Ag・Cu・Ti・Ta・Al・and SiO in for a variety of electronic devices.
ULCOAT form a great amount of super precise pit cavities on glass surface with photolithography process(cleaning, deposition, exposure and chemical etching).
Especially, these applys lead free solder bump process to highend LSI like CPU, lead free solder bump process for Multi-layer 3D chips.
Mold for C4NP
Micro Capillary Device (Fabricated by Wet Etching)
ULCOAT's glass MEMS are formed super precise electrodes array, interconnections, channels and/or holes on glass substrates with photolithography process (a micro-processing technology by MEMS technology). As for glass MEMS(Micro Electro Mechanical Systems) productions, we manufacture functional parts in diverse leading fields, making use of the physical property of glass, and the depsition technology in an order of angstrom(1/10,000,000mm) and the micro processing technology in an order of (1/1000mm) and dry etching technology. In a part of a glass MEMS, there are bio-related DNA-CHIPs, chemical analysis CHIPs μ-TAS, and molds for a solder bumping process (C4NP) for high-end semiconductor devices.
Glass MOLD, BIO chip, etc.
Bio Chip (Thin electrodes are deposited by sputtering)
DNA-CHIP (Fabricated by Wet Etching+Micro Drill)
Micro Capillary Device (Fabricated by Micro Blast)
MicroChemical Chip (Fabricated by Wet Etching+Micro Drill+Bonding)
ULCOAT have deposited various materials on glass substrates with sputtering.
Our main materias : Cr, Cu, Ti, Ta, Al, Al-Si, Au, Ag, W, Ni, Si, SiO2, MoSi etc.
ULCOAT have patterned thin films of various materials with photolithography process.